The Office of the Secretary of Defense Manufacturing Technology Program (OSD ManTech) has announced the winners of the first-of-its-kind "Point of Need Challenge Pitch Event" for solutions to support forward-deployed forces in austere environments.

Held March 8-9 at the ARM Institute in Pittsburgh, Pa., the event showcased technologies generated...

NextFlex hosted a workshop January 18-19 at its Technology Hub in San Jose, CA, designed to explore and align opportunities for hybrid electronics technologies in new and emerging areas of semiconductor packaging. Attended by 100 subject matter experts from industry, academia, and government, the workshop provided opportunities to brainstorm and...

We’re off to a quick start to 2023 with members, industry experts, and government convening here at the Technology Hub to explore opportunities for flexible and additively manufactured hybrid electronics for new and emerging areas of advanced semiconductor packaging. This workshop is designed to capture inputs from the FHE manufacturing community...

It’s been an extremely busy year, and the Executive Director, Malcolm Thompson wants to take this opportunity to thank you for your membership and for your support throughout 2022. We look forward to returning fully to in-person events in 2023, starting with a workshop entitled, “Applications of Hybrid Electronics for Advanced Packaging” on January...

On Friday, October 7, NextFlex welcomed two engineering classes from Independence High School in San Jose to learn about flexible and additively manufactured electronics and to talk with NextFlex engineers about education pathways that lead to challenging careers in manufacturing. The students toured the Technology Hub and were able to get hands-on...