Microelectronics—particularly integrated photonics—has been identified by the U.S. Department of Defense (DoD) as a critical technology for both national and economic security. And while the emerging technology has advanced considerably over the last decade, the development of a highly skilled workforce needed to make integrated photonics...
The Office of the Secretary of Defense Manufacturing Technology Program (OSD ManTech) has announced the winners of the first-of-its-kind "Point of Need Challenge Pitch Event" for solutions to support forward-deployed forces in austere environments.
Held March 8-9 at the ARM Institute in Pittsburgh, Pa., the event showcased technologies generated by...
NextFlex hosted a workshop January 18-19 at its Technology Hub in San Jose, CA, designed to explore and align opportunities for hybrid electronics technologies in new and emerging areas of semiconductor packaging. Attended by 100 subject matter experts from industry, academia, and government, the workshop provided opportunities to brainstorm and...
We’re off to a quick start to 2023 with members, industry experts, and government convening here at the Technology Hub to explore opportunities for flexible and additively manufactured hybrid electronics for new and emerging areas of advanced semiconductor packaging. This workshop is designed to capture inputs from the FHE manufacturing community...
It’s been an extremely busy year, and the Executive Director, Malcolm Thompson wants to take this opportunity to thank you for your membership and for your support throughout 2022. We look forward to returning fully to in-person events in 2023, starting with a workshop entitled, “Applications of Hybrid Electronics for Advanced Packaging” on January...
