PowerAmerica
Virtual
United States
Join PowerAmerica for a free technical webinar on Wednesday, December 4, 2026 at 1 pm ET. Dr. Nick Baker, University of Alabama, will discuss LIME: Liquid-Metal Interconnects for Semiconductors.
This seminar will present the use of liquid-metal pastes for chip-level packaging of SiC MOSFETs. All chip critical interconnects (i.e., die-attach, topside, and gate connections) are implemented using liquid metal, which remains in the liquid phase during semiconductor operation. The seminar will discuss the progressive design and process improvements since the inception of this research in 2018, as well as outlooks for the future and near-term commercialization paths. In comparison to lead-free solder and wire-bonded devices, liquid-metal packaged SiC MOSFETs exhibit lower on-resistance, improved thermal performance, and an order-of-magnitude (potentially up to 100x) increase in power cycling lifetime. Liquid-metal interconnects furthermore enable new high-performance module designs due to the low-temperature, non-toxic manufacturing process, and open the possibility for recycling and reassembly of semiconductor chips and components. Dr. Nick Baker would like to extend credit to more than 25 researchers who have contributed to this work since 2018.