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Semi-Conductor
SMART USA is launching a funding initiative to address critical gaps in semiconductor manufacturing by advancing scalable digital twin technologies. The program targets innovations that enhance semiconductor design, manufacturing, packaging, assembly, and testing. It also aims to strengthen U.S. competitiveness, reduce production costs, improve yields, and build a skilled workforce.
Solicitation Topics
- Using Digital Twins to Optimize Core Semiconductor Manufacturing Processes
- Digital Twins for Advanced Packaging and System Technology Co-Optimization
- Digital Twin Validation Across Semiconductor and/or Packaging Technologies
- Democratizing Access to Community Colleges and other Workforce and Community Programs (Education and Workforce Development)
- Establishing a Library of New and Pre-Existing Content and Educational Training Programs (Education and Workforce Development)