NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications

Hybrid electronics are revolutionizing the automotive and aerospace industries by enabling sophisticated, lightweight, and highly efficient systems that enhance performance and safety. From touch control human machine interfaces, advanced driver-assistance systems (ADAS) to state-of-the-art avionics, hybrid electronics are at the forefront of technological innovation. These advancements have facilitated the electrification of both the automotive and aerospace platforms through the emergence of ground and airborne EVs that boast improved fuel efficiency and reduced emissions. The seamless integration of sensors, processors, and communication modules within these hybrid systems is paving the way for a new era of intelligent transportation solutions. Technical focus areas include manufacturing solutions for integration on automotive and aerospace platforms, technology gaps for the integration of hybrid electronics, product demonstrators, and road mapping. The workshop will feature presentations from subject matter experts and networking with NextFlex members and stakeholders.
 
Who Should Attend:

Engineers and Managers interested in electronics manufacturing, integration, and reliability for defense and commercial applications should attend to learn about new manufacturing methods while meeting or exceeding reliability requirements. 

Event Chairs:

– Dr. Pradeep Lall, Director, Electronics Packaging Research Institute & MacFarlane Distinguished Professor and Alumni Professor, Auburn University
– Dr. John Williams, Boeing Technical Fellow, Boeing
 

For more information and to register: https://www.nextflex.us/event/nextflex-workshop-hybrid-electronics-for-…