PowerAmerica released today a new request for proposals (RFP) on research projects to further accelerate the commercialization of wide-bandgap semiconductor materials — silicon carbide (SiC) and gallium nitride (GaN) — into chips and power electronics.
The total worth of funding for R&D projects supported by “PowerAmerica 2.0” will be roughly...
The National Institute for Innovation in Manufacturing Biopharmaceuticals ( NIIMBL ) and the Open Applications Group, Inc. (OAGi) are proud to announce the release of a groundbreaking set of ontologies designed to enhance data interoperability and analytics capabilities across the biopharmaceutical industry. These ontologies are the result of a...
ASTM International’s Additive Manufacturing Center of Excellence ( AM CoE ) today announced three key milestones advancing the reliability and adoption of additive manufacturing (AM):
Leadership of the Industry Transition Team (ITT) under the America Makes Quality Test and Inspection Methods Expediency (QTIME) program; The launch of...
NLM Photonics, a leader in silicon organic hybrid (SOH) electro-optic technology, announced today that its patented SOH photonic chips, featuring Selerion-HTX™ and JRD1, have successfully arrived at the International Space Station (ISS) as part of NASA's Materials International Space Station Experiment ( MISSE-21 ) mission aboard the JAXA’s HTV-XI...
At the recent NextFlex AI for Hybrid Electronics Workshop in Boston, leaders from across the industrial base came together to explore how artificial intelligence (AI) and machine learning (ML) are transforming design, materials, process control, and system intelligence in hybrid electronics and how they will continue to revolutionize the value...
