Virtual
United States
AIM Photonics Chief Operations Officer David Harame will present at the Integrated Photonics Summit, a virtual event presented by the editors of Photonics Spectra on June 25, 2026, at 10:35 a.m.
A PIC Platform for Chemical and Biosensing: Solutions, Insights, and Capabilities from AIM Photonics
AIM Photonics' mission is to develop photonics and packaging technologies, make these technologies available to the industry, and train a skilled workforce. The base photonic integrated circuit (PIC) platform is an “active” SOI PIC technology that supports O-, C-, and L-bands. This technology is made publicly available through multi-project wafer and full wafer runs in our state-of-the-art 300 mm wafer fabrication and packaging facilities. Users may also customize their respective builds. Most sensing applications utilize minimal builds with undoped silicon and silicon nitride passive components; they’re low-cost and well-suited for single-use, disposable sensors.