Binghamton University
Binghamton , NY
United States
NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to explore and define collaborative responses to soon-to-be-announced opportunities under the CHIPS and Science Act, including the National Advanced Packaging Manufacturing Program (NAPMP), with a specific focus on advancing hybrid electronics for industrial and medical applications.
Visionary speakers will guide participants toward opportunities in both technology advancement and education and workforce development. The workshop will build on NextFlex’s ongoing efforts to advance additive electronics packaging technologies and will include a review of the hybrid electronics manufacturing roadmaps, the state-of-the-art achieved through funded development projects, and manufacturing capabilities across the US, as well as the strategy behind the NextFlex education and workforce development programs that will help inform a proactive response to new opportunities.