We’re off to a quick start to 2023 with members, industry experts, and government convening here at the Technology Hub to explore opportunities for flexible and additively manufactured hybrid electronics for new and emerging areas of advanced semiconductor packaging. This workshop is designed to capture inputs from the FHE manufacturing community on these high priority technical fronts: Direct Write Interconnects, Substrates and Buildup Layers, Interposers, Bridges & Architectures, and Circuitization. Prioritized and actionable contributions collected during the workshop will inform our collective response to opportunities presented by the impending RFP for the CHIPs and Science Act.
We will follow this up with our Winter Symposium on March 28-29, also to be held here at NextFlex. This event will coincide with the release of Project Call 8.0, our eighth project call since our inception. Like previous project calls, this one will focus on prioritized manufacturing gaps identified by the NextFlex Technical Working Groups as outlined in the FHE Manufacturing Roadmap Summary, with an updated version of the published roadmaps anticipated next month. The PC 8.0 activities associated with the Symposium are open to all, while other portions of the agenda that include updates from NextFlex and funded projects will be for members only.