Opportunity

PowerAmerica RFP 2.0

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Funding Opportunity, Wide Bandgap Technologies

Concept Paper questions are due to PowerAmerica by 5pm EST on December 1, 2025 More Information

 

PowerAmerica released a new request for proposals (RFP) on research projects to further accelerate the commercialization of wide-bandgap semiconductor materials — silicon carbide (SiC) and gallium nitride (GaN) — into chips and power electronics.

The total worth of funding for R&D projects supported by “PowerAmerica 2.0” will be roughly $26 million (inclusive of cost-match), broken into the following categories:

  • $9 million in Industry Projects (plus $9M in cost-match);
  • $3.2 million in University Projects (plus $3.2M in cost-match); and
  • $900,000 in Member Initiated Projects (plus $450K in cost-match).

Concept papers are mandatory for full proposal submission — and the Dec. 12 deadline is firm. Full proposals will only be accepted from applicants who receive an “Encourage” recommendation in response to their concept paper submission.