AIM Photonics to Detail Opportunities for Integrated Photonics at OFC 2018

Electronics, Innovation, Manufacturing, Photonics

AIM Photonics-led Technology Information Session to Highlight Updated, State-of-the-Art Process Design Kit, Multi-Project Wafer Capabilities, in Addition to TAP Facility and Overall Initiative Updates

Integrated Photonics Wafer
Integrated Photonics Wafer

The American Institute for Manufacturing Integrated Photonics (AIM Photonics), led by the Department of Defense, announced today that researchers and leaders from the initiative plan to attend the internationally recognized Optical Fiber Communication (OFC) 2018 conference and exhibition March 11-15 in San Diego, California. Conference attendees will be able to learn more about what the initiative offers as AIM Photonics sees strong interest in membership, with more than 80 signed members and additional interested collaborators from across the United States, including those representing areas ranging from industry and academia to government.
At OFC, which bills itself as the largest global conference and exhibition for optical communications and networking professionals, AIM Photonics leaders plan to share integrated silicon photonics-based research and development updates, highlighting the industry-leading photonics Process Design Kit (PDK), which was recently updated to expand the comprehensive set of silicon photonics integrated circuit (PIC) component libraries within SUNY Polytechnic Institute’s (SUNY Poly’s) process to address high-speed optical communications needs. In addition, AIM Photonics representatives will also provide information about opportunities to take part in the initiative’s upcoming, cost-effective Multi Project Wafer (MPW) runs, among other topics.