Packaging challenges have always been a critical part of silicon photonics system design, but packaging requirements have not always been built directly into the design workflow. Instead, designers often rely on guidelines and consultation with packaging teams to ensure compatibility with available processes. However, this collaborative approach can require additional iteration as designs are refined to meet those requirements.
To help bring packaging considerations more directly into the design environment, AIM Photonics has developed its first Assembly Design Kit (ADK). Similar to how a Process Design Kit (PDK) enables designers to create devices compatible with a semiconductor foundry’s manufacturing process, an ADK provides tools and verified components that help ensure photonic integrated circuit (PIC) designs align with available packaging and assembly processes.