Moving at the Speed of Light: University of Arizona Selected for High-Impact, Industrial Demonstration of New Integrated Photonic Cryogenic Datalink

Electronics, Materials, Photonics

The American Institute for Manufacturing Integrated Photonics (AIM Photonics) today announced the winner of a proposal call for a new Defense Department Government Directed Project for photonic integrated circuit (PIC) data links for cryogenic focal plane arrays (FPAs).   The project will encompass the design, fabrication and testing of cryogenic PIC-based datalinks for FPA readout and has the potential to strongly advance imaging capabilities for national defense applications. 

A silicon photonics wafer and optical fibers.
A silicon photonics wafer and optical fibers.

The $1,200,000 U.S. Department of Defense (DoD) project, along with an additional $400,000 in matching funds from a team led by the University of Arizona (UA), will support a consortium that includes Sandia National Labs, Raytheon (RTN) and other aerospace firms engaged in FPA technology.