PowerAmerica has issued a revision to its 2017 Call For Projects that seek to accelerate the adoption of SiC and GaN power electronics technologies. These revisions, highlighted in the document, clarify some of the application and award requirements.
The Call for Projects is primarily focused on the manufacturing of SiC and GaN power semiconductor devices; wide bandgap (WBG) power electronics architectures and assemblies; and packaging and manufacturing processes with the potential to improve performance, lower cost, and create U.S. manufacturing jobs. Projects that demonstrate WBG devices in high volume commercially viable power electronic applications are desired.
Submission Deadline for Concept Paper: Friday, November 10
Response (Invited/Not Invited Notification): Monday, November 27
Submission Deadline for Full Applications: Friday, December 22
Project Start Date: July 1, 2018
The full Call for Projects can be found here.