Updates on the Latest from Nextflex

Education, Flexible Hybrid Electronics, Workforce

It’s been an extremely busy year, and the Executive Director, Malcolm Thompson wants to take this opportunity to thank you for your membership and for your support throughout 2022. We look forward to returning fully to in-person events in 2023, starting with a workshop entitled, “Applications of Hybrid Electronics for Advanced Packaging” on January 19-20. This workshop is being held in collaboration with SEMI, and you can find more information about it on our website here. The purpose of this workshop is to convene members, government partners, and the US FHE manufacturing ecosystem to discuss opportunities in emerging areas of advanced semiconductor packaging. As we await the release of the RFPs for programs within the CHIPS and Science Act, we seek to align our vision to the needs of the ecosystem and determine how we can shape future domestic packaging capabilities. We hope you will attend.

Earlier this year, Heidi Shyu, the Under Secretary of Defense sent out a memorandum to the Defense Manufacturing Community recognizing 10 years of DoD partnership with the Manufacturing Innovation Institutes (MIIs). The first institute to launch was America Makes in August of 2012, just over 10 years ago. Today there are nine DoD MIIs with over 1,580 members collectively. The DoD MIIs have leveraged $1.5B in Federal funding and $2.2B in private-sector cost share, executing more than 1,110 applied research projects and more than 480 education and workforce development projects. Click here for the full memorandum and learn more about how the MIIs are developing advanced manufacturing solutions for national and economic security.