Fellow awards acknowledge individuals who go above and beyond to push FHE development toward manufacturability and commercialization.

In addition to recognizing these all-stars’ accomplishments, the NextFlex Fellows awards acknowledge that working together alongside fellow NextFlex members will greatly increase the rate of innovation in the FHE...

Lightweight, low-cost and flexible electronic systems are the key to next-generation smart technologies for military as well as consumer and commercial applications.

An Air Force Research Laboratory-led project in conjunction with NextFlex, America’s Flexible Hybrid Electronics Institute, has led to the development of a new, flexible Arduino...

Researchers from North Carolina State University are rolling out a new manufacturing process and chip design for silicon carbide (SiC) power devices, which can be used to more efficiently regulate power in technologies that use electronics. The process – called PRESiCE™ – was developed with support from the PowerAmerica Institute funded by the...